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Deep-ultraviolet (DUV) immersion lithography scanner for advanced semiconductor critical-layer patterning. Delivers superior overlay accuracy and ultra-high throughput for multiple-patterning nodes, serving foundries and IDMs competing with EUV on trailing-edge and established nodes. Nikon holds roughly 20% of the global scanner market behind ASML, making the NSR-S636E its primary revenue driver in the Precision Equipment division.
Maskless digital lithography system for advanced semiconductor packaging applications, supporting substrates up to 600 mm square at 1.0 μm resolution. Commenced order-taking in July 2025, targeting chiplet and heterogeneous integration customers who need panel-level fan-out and large-area redistribution-layer patterning without reticles. Marks Nikon's first back-end-process lithography product.
Broad portfolio of coordinate measuring machines (CMMs), laser trackers, X-ray CT systems, and shop-floor vision inspection equipment for automotive, aerospace, and semiconductor manufacturing. Integrates Aeva FMCW LiDAR sensors (per a 2025 multi-year production agreement) for next-generation high-precision inspection. Deployed by automotive OEMs and Tier 1 suppliers for closed-loop quality control and tolerance verification.
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