Applied Materials

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  5d ago·544 views

  DRAM Master Class: High-bandwidth memory (HBM)

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  1w ago·556 views

  DRAM Master Class: Panel-based Packaging

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  1w ago·741 views

  Deliver Material Innovation at Applied Materials

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  2w ago·402 views

  DRAM Master Class: 3D DRAM

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  2w ago·158 views

  DRAM Master Class: CMOS-Bonded Arrays

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  1mo ago·270 views

  DRAM Master Class: AI Scaling(clip)

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• Deposition Systems (CVD, PVD, Epitaxy)

  Tools that lay down the ultra-thin conductive, dielectric, and barrier films forming each layer of a chip, using chemical vapor deposition, physical vapor deposition (sputtering), and epitaxial growth. Applied Materials is the market leader in deposition, and its Endura and Producer platforms are workhorses in virtually every advanced fab. These systems are critical for gate-all-around transistors and advanced interconnects.

• Etch & Selective Removal Systems

  Equipment that precisely removes material to define transistor and interconnect structures, including conductor and dielectric etch plus selective-removal tools like the Sym3 and SelectraTM platforms. Atomic-scale precision is essential as features shrink and 3D architectures (3D NAND, gate-all-around) proliferate, making etch one of the fastest-growing and most technically demanding steps in chipmaking.

• Process Diagnostics & Control (eBeam Metrology/Inspection)

  Imaging, metrology, and inspection systems—including high-resolution eBeam tools—that measure dimensions and detect defects across the wafer to maximize yield. As process margins tighten at advanced nodes, this PDC portfolio gives fabs the visibility needed to control variation. It is a high-growth, high-margin segment central to Applied's role in enabling smaller, denser chips.

• Advanced Packaging & Heterogeneous Integration

  Equipment for chiplet-based and 3D integration—through-silicon vias, hybrid bonding, and wafer-level packaging—that stitches multiple dies into a single high-performance package. As transistor scaling slows, advanced packaging is increasingly where AI-accelerator performance gains come from, positioning Applied Materials at the center of heterogeneous-integration roadmaps for HBM and multi-die designs.

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