KLA (KLAC) is a publicly traded Lithography & Equipment company founded in 1976 and based in Milpitas, USA.
| Date | Stage | Amount | Valuation | Lead investors |
|---|---|---|---|---|
| Oct 8, 1980 | IPO | — | — | — |
KLA reported Q3 FY2026 revenue of $3.415 billion, up 11.5% year-over-year, exceeding the midpoint of guidance. GAAP net income reached $1.201 billion with diluted EPS of $9.12, both above guidance midpoints. Non-GAAP EPS was $9.40. The Semiconductor Process Control segment drove results with $3.084 billion in revenue. Operating cash flow for the quarter was $707.5 million; free cash flow was $622.3 million. For the 12-month period, operating cash flow reached $4.40 billion and free cash flow $4.01 billion. The Board approved a dividend increase to $2.30 per share (17th consecutive annual increase) and authorized an additional $7 billion in share repurchases. Capital returns in the quarter totaled $874.8 million. Management attributed momentum to AI infrastructure buildout across foundry, logic, memory, advanced packaging, and services.
Q4 FY2026 revenue $3.575B ± $200M; GAAP gross margin 60.72% ± 1.00%; GAAP diluted EPS $9.66 ± $1.00
KLA owns roughly half the process-control market: the inspection and metrology tools that tell a fab whether its wafers will yield, built on decades of optics and defect-signature data no entrant can shortcut. The margins state the pricing case — the highest in semiconductor equipment, sustained across cycles, because at the leading edge there is frequently no peer substitute for the flagship inspectors. Better still, every node transition makes chips harder to see into, so process-control intensity rises structurally: complexity is the tailwind, not the threat. Cyclical WFE exposure and China export policy are what the grade watches.

Photoluminescence inspection offers new defect detection for SiC and GaN wafer manufacturing as the industry transitions to larger substrate sizes.

Inspection and metrology tools adapt to the demands of high-density fan-out panel packaging for large AI/HPC devices.

Deep UV lithography processing remains critical to EUV manufacturing, enabling continued Moore's Law advancement in logic and memory nodes.
KLA's flagship patterned-wafer defect inspection systems and the core of its process-control dominance. The 3900 Series uses a super-resolution deep-UV (SR-DUV) wavelength range and scanner-grade stage accuracy to detect sub-10nm defects on leading-edge logic and memory wafers; the 2930 Series adds complementary DUV/UV bands for optimal contrast across process layers. These tools are the gating technology for yield ramp at advanced and high-NA EUV nodes.
KLA's electron-beam portfolio for defect review, classification, and high-resolution inspection. The eDR7280 e-beam review tool images and classifies the smallest yield-killing defects found by optical inspectors, while e-beam inspection systems resolve defects below the optical limit. E-beam complements broadband-plasma optical inspection, giving fabs the resolution needed to characterize physical and electrical defects at the most advanced nodes.
Industry-standard overlay metrology tools that measure pattern-to-pattern alignment error between lithography layers. As multi-patterning and EUV tighten overlay budgets to single-digit nanometers, the Archer Series characterizes and feeds back overlay error to keep advanced patterning within spec. It is a key part of KLA's metrology franchise alongside its inspection systems for leading-edge manufacturing.
192 patents on file, but none with both an extractable figure and an abstract on Google Patents yet.