KLA

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  KLA Instruments Nanoindentation for Advanced Technologies

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  We Are KLA

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  Discover KLA

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  KLA Technologies

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  KLA Innovations 2018 - Extending the Boundaries of Process Control

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  KLA

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• Broadband Plasma Optical Inspectors (39xx / 29xx Series)

  KLA's flagship patterned-wafer defect inspection systems and the core of its process-control dominance. The 3900 Series uses a super-resolution deep-UV (SR-DUV) wavelength range and scanner-grade stage accuracy to detect sub-10nm defects on leading-edge logic and memory wafers; the 2930 Series adds complementary DUV/UV bands for optimal contrast across process layers. These tools are the gating technology for yield ramp at advanced and high-NA EUV nodes.

• eDR e-beam Review & eS Inspection Systems

  KLA's electron-beam portfolio for defect review, classification, and high-resolution inspection. The eDR7280 e-beam review tool images and classifies the smallest yield-killing defects found by optical inspectors, while e-beam inspection systems resolve defects below the optical limit. E-beam complements broadband-plasma optical inspection, giving fabs the resolution needed to characterize physical and electrical defects at the most advanced nodes.

• Archer Overlay Metrology Series

  Industry-standard overlay metrology tools that measure pattern-to-pattern alignment error between lithography layers. As multi-patterning and EUV tighten overlay budgets to single-digit nanometers, the Archer Series characterizes and feeds back overlay error to keep advanced patterning within spec. It is a key part of KLA's metrology franchise alongside its inspection systems for leading-edge manufacturing.

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